


| Parameter | Value |
|---|---|
| Benefit: (Features) | Fast machining and assembly of components without the risk of undesired contact of the electrical components and the enclosure. |
| Feature: (Features) | Insulated mounting plate. |
| Advantage: (Features) | The nonconductive mounting plate can be machined and equipped with components before it is assembled in the enclosure. |
| Material: (Technical data) | hard paper 5 mm. |
| Description: (Technical data) | Insulated mounting plate for UDP/UDPT enclosures. |
| Pack quantity: (Technical data) | 1 piece. |
Technical specifications and performance data
Installation and operation guide