

| Parameter | Value |
|---|---|
| 0.2 mm² / flexible / > 10 N | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 3.5 mm |
| Result | Test passed |
| Process | Reflow soldering |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Frequency | 10 - 150 - 10 Hz |
| Width [w] | 35.5 mm |
| Height [h] | 7.7 mm |
| Length [l] | 13.6 mm |
| Pin layout | Linear pad geometry |
| Pin spacing | 7 mm |
| Sweep speed | 1 octave/min |
| Temperature | 850 °C |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Pad geometry | 1.6 x 4 mm |
| Product line | COMBICON Terminals S |
| Product type | Printed circuit board terminal |
| Assembly note | This item is not suitable for PCB cleaning with liquids. |
| Hole diameter | 1.1 mm |
| Mounting type | SMD soldering |
| Specification | IEC 60998-2-2:2002-12 |
| Number of rows | 1 |
| Pin dimensions | 0.7 x 0.3 mm |
| Product family | SPT 1,5/..-H-SMD |
| Color (Housing) | black (9005) |
| Test directions | X-, Y- and Z-axis |
| Article revision | 02 |
| Contact material | Cu alloy |
| Installed height | 7.7 mm |
| Stripping length | 8 mm |
| Time of exposure | 5 s |
| Connection method | Push-in spring connection |
| Type of packaging | packed in cardboard |
| Nominal current IN | 17.5 A |
| Nominal voltage UN | 160 V |
| Notes on operation | The solder anchors on the outer poles reduce the mechanical strain on the SMD soldering spots. |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 10 |
| Number of potentials | 10 |
| Rated voltage (II/2) | 320 V |
| Nominal cross section | 1.5 mm² |
| Number of connections | 10 |
| Rated voltage (III/2) | 160 V |
| Rated voltage (III/3) | 160 V |
| Test duration per axis | 2.5 h |
| Surface characteristics | hot-dip tin-plated |
| Moisture Sensitive Level | MSL 1 |
| Color (Actuating element) | white (9010) |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 2.5 kV |
| Conductor cross section AWG | 24 ... 16 |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated surge voltage (III/3) | 2.5 kV |
| Solder cycles in the reflow | 3 |
| Classification temperature Tc | 260 °C |
| Conductor cross section rigid | 0.2 mm² ... 1.5 mm² |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
| Rated insulation voltage (II/2) | 320 V |
| Conductor cross section flexible | 0.2 mm² ... 1.5 mm² |
| Rated insulation voltage (III/2) | 160 V |
| Rated insulation voltage (III/3) | 160 V |
| minimum creepage distance (II/2) | 3.2 mm |
| Requirement temperature-rise test | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
| minimum creepage distance (III/2) | 1.6 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
| Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
| Insulation resistance, neighboring positions | > 5 MΩ |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.2 mm² ... 0.75 mm² |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.2 mm² ... 1.5 mm² |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
Technical specifications and performance data
Installation and operation guide