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SAMPLE PTSM 0,5/ 2-HHI-2,5-SMD
SAMPLE PTSM 0,5/ 2-HHI-2,5-SMD 1820712 PHOENIX CONTACT Sample set
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4347 in stock
Key Specifications
Note:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Pitch:2.5 mm
Result:Test passed
Process:Reflow soldering
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Technical Specifications
| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 2.5 mm |
| Result | Test passed |
| Process | Reflow soldering |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Frequency | 10 - 150 - 10 Hz |
| Width [w] | 9.8 mm |
| Height [h] | 5 mm |
| Length [l] | 14 mm |
| Pin layout | Linear pad geometry |
| Sweep speed | 1 octave/min |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Pad geometry | 1.2 x 3.2 mm |
| Product line | COMBICON Connectors XS |
| Product type | PCB headers |
| Hole diameter | 1.1 mm |
| Mounting type | SMD soldering |
| No. of cycles | 25 |
| Specification | IEC 60512-1-1:2002-02 |
| Number of rows | 1 |
| Product family | PTSM 0,5/..-HHI-SMD |
| Thermal stress | 100 °C/168 h |
| Color (Housing) | black (9005) |
| Mounting flange | without |
| Test directions | X-, Y- and Z-axis |
| Article revision | 01 |
| Contact material | Cu alloy |
| Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Installed height | 5 mm |
| Type of packaging | packed in cardboard |
| Contact resistance | 3.6 mΩ |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 2 |
| Number of potentials | 2 |
| Rated voltage (II/2) | 200 V |
| Contact resistance R1 | 3.6 mΩ |
| Contact resistance R2 | 3.8 mΩ |
| Number of connections | 2 |
| Rated voltage (III/2) | 160 V |
| Rated voltage (III/3) | 63 V |
| Solder pin length [P] | 2 mm |
| Test duration per axis | 2.5 h |
| Surface characteristics | Tin-plated |
| Moisture Sensitive Level | MSL 1 |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 2.5 kV |
| Tested number of positions | 8 |
| Insertion/withdrawal cycles | 25 |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated surge voltage (III/3) | 2.5 kV |
| Solder cycles in the reflow | 3 |
| Classification temperature Tc | 260 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Rated insulation voltage (II/2) | 200 V |
| Rated insulation voltage (III/2) | 160 V |
| Rated insulation voltage (III/3) | 63 V |
| minimum creepage distance (II/2) | 2 mm |
| Power-frequency withstand voltage | 0.84 kV |
| minimum creepage distance (III/2) | 1.6 mm |
| minimum creepage distance (III/3) | 2 mm |
| Withdraw strength per pos. approx. | 4 N |
| Insertion strength per pos. approx. | 4 N |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Impulse withstand voltage at sea level | 1.75 kV |
| Metal surface contact area (top layer) | Tin (3 - 8 µm Sn) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Tin (3 - 8 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Contact holder in insertRequirements >20 N | Test passed |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Insulation resistance, neighboring positions | > 5 MΩ |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
Product Description
Printed circuit board base case, nominal section: 0.5 mm², color: black, nominal current: 6 A, nominal voltage (III/2): 160 V, contact surface: Tin, contact type: Female, number of potentials: 2, numb
Key Features
- Industrial grade quality
- RoHS compliant
- CE certified
- 1-year warranty
Product Documents
Datasheet
Technical specifications and performance data
User Manual
Installation and operation guide
