

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Type | Component suitable for through hole reflow |
| Pitch | 2.54 mm |
| Result | Test passed |
| Process | Reflow/wave soldering |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Frequency | 10 - 500 - 10 Hz |
| Width [w] | 41.14 mm |
| Height [h] | 7.39 mm |
| Length [l] | 9.64 mm |
| Pin layout | Linear pinning |
| Pin spacing | 2.54 mm |
| Sweep speed | 1 octave/min |
| Acceleration | 5g (60.1 Hz ... 500 Hz) |
| Product line | COMBICON Connectors XS |
| Product type | PCB headers |
| Hole diameter | 1.2 mm |
| Mounting type | THR soldering / wave soldering |
| No. of cycles | 100 |
| Specification | IEC 60512-1-1:2002-02 |
| Number of rows | 2 |
| Pin dimensions | 0.64 x 0.64 mm |
| Product family | DMC 0,5/..-G1-THR |
| Thermal stress | 100 °C/168 h |
| Color (Housing) | black (9005) |
| Mounting flange | without |
| Test directions | X-, Y- and Z-axis |
| Article revision | 02 |
| Contact material | Cu alloy |
| Corrosive stress | 1.0 dm3SO2on 300 dm3/40 °C/3 cycles |
| Installed height | 5.39 mm |
| Type of packaging | packed in cardboard |
| Contact resistance | 2.7 mΩ |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 16 |
| Number of potentials | 32 |
| Rated voltage (II/2) | 160 V |
| Contact resistance R1 | 2.7 mΩ |
| Contact resistance R2 | 2.9 mΩ |
| Number of connections | 32 |
| Rated voltage (III/2) | 160 V |
| Rated voltage (III/3) | 32 V |
| Solder pin length [P] | 2 mm |
| Test duration per axis | 2 h |
| Surface characteristics | Completely gold-plated |
| Moisture Sensitive Level | MSL 1 |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 2.5 kV |
| Tested number of positions | 16 |
| Insertion/withdrawal cycles | 100 |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated surge voltage (III/3) | 2.5 kV |
| Solder cycles in the reflow | 3 |
| Classification temperature Tc | 260 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Contact resistance R22nd level | 3.1 mΩ |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Rated insulation voltage (II/2) | 160 V |
| Rated insulation voltage (III/2) | 160 V |
| Rated insulation voltage (III/3) | 32 V |
| minimum creepage distance (II/2) | 1.6 mm |
| Power-frequency withstand voltage | 1.39 kV |
| minimum creepage distance (III/2) | 1.6 mm |
| minimum creepage distance (III/3) | 1.3 mm |
| Withdraw strength per pos. approx. | 1 N |
| Insertion strength per pos. approx. | 2 N |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Metal surface contact area (top layer) | Gold (0.25 Au) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Gold (0.25 Au) |
| Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
| Contact holder in insertRequirements >20 N | Test passed |
| Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
| Insulation resistance, neighboring positions | > 5 MΩ |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
Technical specifications and performance data
Installation and operation guide