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MCV 1,5/ 6-GFR-3,5 GN THTV0004 - MCV 1,5/ 6-GFR-3,5 GN THTV0004 1769333 PHOENIX CONTACT Printed-circuit board connector
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MCV 1,5/ 6-GFR-3,5 GN THTV0004

MCV 1,5/ 6-GFR-3,5 GN THTV0004 1769333 PHOENIX CONTACT Printed-circuit board connector

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4003 in stock
Key Specifications
Note:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Pitch:3.5 mm
Color ():()
Product line:COMBICON Connectors S
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Technical Specifications

ParameterValue
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Pitch3.5 mm
Color ()()
Product lineCOMBICON Connectors S
Product typePCB headers
Mounting typeTHR soldering / wave soldering
SpecificationIEC 60664-1:2007-04
Number of rows1
Pin dimensions0.8 x 0.8 mm
Product familyMCV 1,5/..-GFR-THT
[W] tape width56 mm
Article revision02
Contact materialCu alloy
Tightening torque0.3 Nm
Type of packaging56 mm wide tape
[A] coil diameter330 mm
Nominal current IN8 A
Nominal voltage UN160 V
Dimensional drawing
Insulating materialPA
Number of positions6
Number of potentials6
Outer packaging typeDry bag
Rated voltage (II/2)250 V
Number of connections6
Rated voltage (III/2)160 V
Rated voltage (III/3)160 V
Surface characteristicsTin-plated
Insulating material groupIIIa
Solder pins per potential1
CTI according to IEC 60112250
Rated surge voltage (II/2)2.5 kV
Rated surge voltage (III/2)2.5 kV
Rated surge voltage (III/3)2.5 kV
[W2] coil overall dimension62.4 mm
Ambient temperature (assembly)-5 °C ... 100 °C
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Rated insulation voltage (II/2)250 V
Rated insulation voltage (III/2)160 V
Rated insulation voltage (III/3)160 V
minimum creepage distance (II/2)2.5 mm
minimum creepage distance (III/2)1.6 mm
minimum creepage distance (III/3)2.5 mm
Relative humidity (storage/transport)30 % ... 70 %
Flammability rating according to UL 94V0
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Comparative tracking index (IEC 60112)CTI 250
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (middle layer)Nickel (1.3 - 3 µm Ni)
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum clearance value - non-homogenous field (III/3)1.5 mm
Glow wire flammability index GWFI according to EN 60695-2-12850
Glow wire ignition temperature GWIT according to EN 60695-2-13775
Temperature for the ball pressure test according to EN 60695-10-2125 °C

Product Description

PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 1, number o
Key Features
  • Industrial grade quality
  • RoHS compliant
  • CE certified
  • 1-year warranty

Product Documents

Datasheet

Technical specifications and performance data

User Manual

Installation and operation guide

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