

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 3.5 mm |
| Color () | () |
| Width [w] | 15.4 mm |
| Height [h] | 11.8 mm |
| Length [l] | 6.9 mm |
| Pin layout | Linear pinning |
| Product line | COMBICON Connectors S |
| Product type | PCB headers |
| Hole diameter | 1.4 mm |
| Mounting type | THR soldering / wave soldering |
| Specification | IEC 60664-1:2007-04 |
| Number of rows | 1 |
| Product family | MCV 1,5/..-G-RN-THR |
| [W] tape width | 56 mm |
| Mounting flange | Engagement nose |
| Article revision | 00 |
| Contact material | Cu alloy |
| Installed height | 9.2 mm |
| Type of packaging | 56 mm wide tape |
| [A] coil diameter | 330 mm |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 4 |
| Number of potentials | 4 |
| Outer packaging type | Transparent-Bag |
| Rated voltage (II/2) | 250 V |
| Number of connections | 4 |
| Rated voltage (III/2) | 160 V |
| Rated voltage (III/3) | 160 V |
| Solder pin length [P] | 2.6 mm |
| Surface characteristics | partially gold-plated |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 2.5 kV |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated surge voltage (III/3) | 2.5 kV |
| [W2] coil overall dimension | 62.4 mm |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Rated insulation voltage (II/2) | 250 V |
| Rated insulation voltage (III/2) | 160 V |
| Rated insulation voltage (III/3) | 160 V |
| minimum creepage distance (II/2) | 2.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
| Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
Technical specifications and performance data
Installation and operation guide