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MCDNV 1,5/ 8-G1-3,5 P26THRGNAU - MCDNV 1,5/ 8-G1-3,5 P26THRGNAU 1704929 PHOENIX CONTACT Feed-through header
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MCDNV 1,5/ 8-G1-3,5 P26THRGNAU

MCDNV 1,5/ 8-G1-3,5 P26THRGNAU 1704929 PHOENIX CONTACT Feed-through header

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3621 in stock
Key Specifications
Note:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Type:Component suitable for through hole reflow
Pitch:3.5 mm
Width [w]:29.5 mm
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Technical Specifications

ParameterValue
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
TypeComponent suitable for through hole reflow
Pitch3.5 mm
Width [w]29.5 mm
Height [h]13.3 mm
Length [l]16 mm
Pin layoutLinear pinning
Pin spacing3.50 mm
Product lineCOMBICON Connectors S
Product typePCB headers
Hole diameter1.3 mm
Mounting typeTHR soldering / wave soldering
SpecificationIEC 60664-1:2007-04
Number of rows2
Pin dimensions0.8 x 0.8 mm
Product familyMCDNV 1,5/..-G1-THR
Color (Housing)green (6021)
Mounting flangeno
Article revision05
Contact materialCu alloy
Installed height15.9 mm
Type of packagingpacked in cardboard
Nominal current IN6 A
Nominal voltage UN160 V
Dimensional drawing
Insulating materialLCP
Number of positions8
Number of potentials16
Rated voltage (II/2)250 V
Number of connections16
Rated voltage (III/2)160 V
Rated voltage (III/3)160 V
Solder pin length [P]2.6 mm
Surface characteristicsCompletely gold-plated
Insulating material groupIIIa
Solder pins per potential1
CTI according to IEC 60112175
Rated surge voltage (II/2)2.5 kV
Rated surge voltage (III/2)2.5 kV
Rated surge voltage (III/3)2.5 kV
Ambient temperature (assembly)-5 °C ... 100 °C
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Details for soldering processesProcessing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C
Rated insulation voltage (II/2)250 V
Rated insulation voltage (III/2)160 V
Rated insulation voltage (III/3)160 V
minimum creepage distance (II/2)2.5 mm
minimum creepage distance (III/2)1.6 mm
minimum creepage distance (III/3)2.5 mm
Relative humidity (storage/transport)30 % ... 70 %
Flammability rating according to UL 94V0
Metal surface contact area (top layer)Gold (0.8 - 1.4 µm Au)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Comparative tracking index (IEC 60112)CTI 175
Metal surface soldering area (top layer)Gold (0.8 - 1.4 µm Au)
Metal surface contact area (middle layer)Nickel (1 - 3 µm Ni)
Metal surface soldering area (middle layer)Nickel (1 - 3 µm Ni)
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum clearance value - non-homogenous field (III/3)1.5 mm

Product Description

Printed circuit board base case, nominal section: 1.5 mm², color: green, nominal current: 6 A, nominal voltage (III/2): 160 V, contact surface: Gold, contact type: Male, number of potentials: 16, numb
Key Features
  • Industrial grade quality
  • RoHS compliant
  • CE certified
  • 1-year warranty

Product Documents

Datasheet

Technical specifications and performance data

User Manual

Installation and operation guide

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