

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Type | Component suitable for through hole reflow |
| Pitch | 3.5 mm |
| Width [w] | 29.5 mm |
| Height [h] | 13.3 mm |
| Length [l] | 16 mm |
| Pin layout | Linear pinning |
| Pin spacing | 3.50 mm |
| Product line | COMBICON Connectors S |
| Product type | PCB headers |
| Hole diameter | 1.3 mm |
| Mounting type | THR soldering / wave soldering |
| Specification | IEC 60664-1:2007-04 |
| Number of rows | 2 |
| Pin dimensions | 0.8 x 0.8 mm |
| Product family | MCDNV 1,5/..-G1-THR |
| Color (Housing) | green (6021) |
| Mounting flange | no |
| Article revision | 05 |
| Contact material | Cu alloy |
| Installed height | 15.9 mm |
| Type of packaging | packed in cardboard |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 8 |
| Number of potentials | 16 |
| Rated voltage (II/2) | 250 V |
| Number of connections | 16 |
| Rated voltage (III/2) | 160 V |
| Rated voltage (III/3) | 160 V |
| Solder pin length [P] | 2.6 mm |
| Surface characteristics | Completely gold-plated |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 2.5 kV |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated surge voltage (III/3) | 2.5 kV |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Rated insulation voltage (II/2) | 250 V |
| Rated insulation voltage (III/2) | 160 V |
| Rated insulation voltage (III/3) | 160 V |
| minimum creepage distance (II/2) | 2.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1 - 3 µm Ni) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
Technical specifications and performance data
Installation and operation guide