

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 5.08 mm |
| Width [w] | 44.68 mm |
| Height [h] | 10.65 mm |
| Length [l] | 9.2 mm |
| Pin layout | Linear pinning |
| Product line | COMBICON Connectors S |
| Product type | PCB headers |
| Hole diameter | 1.2 mm |
| Mounting type | Wave soldering |
| Number of rows | 1 |
| Product family | MC 1,5/..-GF |
| Color (Housing) | green (6021) |
| Mounting flange | Threaded flange |
| Article revision | 05 |
| Contact material | Cu alloy |
| Installed height | 7.25 mm |
| Tightening torque | 0.3 Nm |
| Type of packaging | packed in cardboard |
| Nominal current IN | 8 A |
| Dimensional drawing | |
| Insulating material | PA |
| Number of positions | 7 |
| Number of potentials | 7 |
| Number of connections | 7 |
| Rated voltage (III/3) | 250 V |
| Solder pin length [P] | 3.4 mm |
| Surface characteristics | partially gold-plated |
| Insulating material group | I |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 600 |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Rated insulation voltage (III/3) | 250 V |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
Technical specifications and performance data
Installation and operation guide