

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 1.27 mm |
| Process | Reflow soldering |
| Amplitude | 1.5 mm (10 Hz ... 58 Hz) |
| ESD level | (D) electrostatically conductive |
| Frequency | 10 - 2000 - 10 Hz |
| Width [w] | 68.59 mm |
| Height [h] | 4.95 mm |
| Length [l] | 10.05 mm |
| Pin layout | Linear pad geometry |
| Pulse shape | Semi-sinusoidal |
| Sweep speed | 1 octave/min |
| Wipe length | 1.5 mm |
| Acceleration | 490 m/s² |
| Pad geometry | 0.8 x 0.8 mm |
| Product type | SMD male connector |
| Test voltage | 500 V AC IEC 60512-4-1:2003 |
| Center offset | ± 0.7 mm in longitudinal and transverse direction |
| Contact cover | 0.9 mm |
| Mounting type | SMD soldering |
| Specification | IEC 60512-5-2:2002-02 |
| Number of rows | 2 |
| Product family | FR 1,27/..-MH |
| Shock duration | 11 ms |
| [W] tape width | 88 mm |
| Color (Housing) | black (9005) |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Contact material | Cu alloy |
| Installed height | 4.25 mm |
| Angular tolerance | ± 5 ° in longitudinal and transverse direction |
| Cross section AWG | (converted acc. to IEC) |
| Type of packaging | 88 mm wide tape |
| [A] coil diameter | 330 mm |
| Contact resistance | 10 mΩ |
| Nominal current IN | 2 A IEC 60512-5-2:2002-02 (at 20°C 100-pos.) |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Degree of pollution | 3 |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 100 |
| Outer packaging type | Transparent-Bag |
| Contact resistance R1 | 10 mΩ |
| Contact resistance R2 | 15 mΩ |
| Test duration per axis | 2.5 h |
| Surface characteristics | Selective coating |
| Moisture Sensitive Level | MSL 1 |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Insertion/withdrawal cycles | 500 |
| Solder cycles in the reflow | 3 |
| [W2] coil overall dimension | 94.4 mm |
| Classification temperature Tc | 260 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Metal surface contact area (top layer) | Gold (Au) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Minimum value for clearance and creepage distance | 0.42 mm |
Technical specifications and performance data
Installation and operation guide