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DMC 1,5/ 2-G1F-3,5-LRP26AUTHR - DMC 1,5/ 2-G1F-3,5-LRP26AUTHR 1711101 PHOENIX CONTACT Printed-circuit board connector
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DMC 1,5/ 2-G1F-3,5-LRP26AUTHR

DMC 1,5/ 2-G1F-3,5-LRP26AUTHR 1711101 PHOENIX CONTACT Printed-circuit board connector

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4021 in stock
Key Specifications
Note:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Pitch:3.5 mm
Result:Test passed
Process:Reflow/wave soldering
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Technical Specifications

ParameterValue
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Pitch3.5 mm
ResultTest passed
ProcessReflow/wave soldering
Color ()()
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Frequency10 - 500 - 10 Hz
Width [w]14 mm
Height [h]13.4 mm
Length [l]11.6 mm
Pin layoutLinear double pinning
Pin spacing2.50 mm
Sweep speed1 octave/min
Acceleration5g (60.1 Hz ... 500 Hz)
Product lineCOMBICON Connectors S
Product typePCB headers
Hole diameter1.4 mm
Mounting typeTHR soldering / wave soldering
No. of cycles100
SpecificationIEC 60512-1-1:2002-02
Number of rows2
Pin dimensions0.8 x 0.8 mm
Product familyDMC 1,5/..-G1F-THR
Thermal stress100 °C/168 h
Test directionsX-, Y- and Z-axis
Article revision02
Contact materialCu alloy
Corrosive stress1.0 dm3SO2on 300 dm3/40 °C/1 cycle
Installed height10.8 mm
Tightening torque0.2 Nm
Type of packagingpacked in cardboard
Contact resistance2 mΩ
Nominal current IN8 A
Nominal voltage UN160 V
Dimensional drawing
Insulating materialLCP
Number of positions2
Number of potentials4
Rated voltage (II/2)250 V
Contact resistance R12 mΩ
Contact resistance R21.8 mΩ
Number of connections4
Rated voltage (III/2)160 V
Rated voltage (III/3)160 V
Solder pin length [P]2.6 mm
Test duration per axis2 h
Surface characteristicspartially gold-plated
Moisture Sensitive LevelMSL 1
Insulating material groupIIIa
Solder pins per potential1
CTI according to IEC 60112175
Rated surge voltage (II/2)2.5 kV
Tested number of positions9
Insertion/withdrawal cycles100
Rated surge voltage (III/2)2.5 kV
Rated surge voltage (III/3)2.5 kV
Solder cycles in the reflow3
Classification temperature Tc260 °C
Ambient temperature (assembly)-5 °C ... 100 °C
Contact resistance R22nd level1.9 mΩ
Ambient temperature (operation)-40 °C ... 105 °C (dependent on the derating curve)
Rated insulation voltage (II/2)250 V
Rated insulation voltage (III/2)160 V
Rated insulation voltage (III/3)160 V
minimum creepage distance (II/2)2.5 mm
Power-frequency withstand voltage1.39 kV
minimum creepage distance (III/2)1.6 mm
minimum creepage distance (III/3)2.5 mm
Withdraw strength per pos. approx.1.4 N
Insertion strength per pos. approx.2.6 N
Relative humidity (storage/transport)30 % ... 70 %
Flammability rating according to UL 94V0
Impulse withstand voltage at sea level2.95 kV
Metal surface contact area (top layer)Gold (0.8 - 1.4 µm Au)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Comparative tracking index (IEC 60112)CTI 175
Metal surface soldering area (top layer)Gold (0.1 - 0.8 µm Au)
Metal surface contact area (middle layer)Nickel (2 - 4 µm Ni)
Contact holder in insertRequirements >20 NTest passed
Metal surface soldering area (middle layer)Nickel (2 - 4 µm Ni)
Insulation resistance, neighboring positions> 5 MΩ
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum clearance value - non-homogenous field (III/3)1.5 mm

Product Description

PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 4, number of rows: 2, number o
Key Features
  • Industrial grade quality
  • RoHS compliant
  • CE certified
  • 1-year warranty

Product Documents

Datasheet

Technical specifications and performance data

User Manual

Installation and operation guide

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