

| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Pitch | 7.62 mm |
| Color () | () |
| Product line | COMBICON Connectors L |
| Product type | Feed-through header |
| Mounting type | Soldering |
| Specification | IEC 60664-1:2007-04 |
| Number of rows | 1 |
| Product family | DFK-PC 4/..-G -LOE |
| Mounting flange | without |
| Article revision | 00 |
| Contact material | Cu alloy |
| Installed height | 14 mm |
| Type of packaging | packed in cardboard |
| Nominal current IN | 15 A |
| Nominal voltage UN | 400 V |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | |
| Insulating material | PA |
| Number of positions | 3 |
| Rated voltage (II/2) | 800 V |
| Rated voltage (III/2) | 400 V |
| Rated voltage (III/3) | 400 V |
| Surface characteristics | Tin-plated |
| Insulating material group | I |
| Solder pins per potential | 2 |
| CTI according to IEC 60112 | 600 |
| Rated surge voltage (II/2) | 6 kV |
| Rated surge voltage (III/2) | 6 kV |
| Rated surge voltage (III/3) | 6 kV |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Rated insulation voltage (II/2) | 800 V |
| Rated insulation voltage (III/2) | 400 V |
| Rated insulation voltage (III/3) | 400 V |
| minimum creepage distance (II/2) | 5.5 mm |
| minimum creepage distance (III/2) | 5.5 mm |
| minimum creepage distance (III/3) | 5.5 mm |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V2 |
| Metal surface contact area (top layer) | Tin (5 - 7 µm Sn) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (middle layer) | Nickel (2 - 3 µm Ni) |
| minimum clearance value - non-homogenous field (II/2) | 5.5 mm |
| minimum clearance value - non-homogenous field (III/2) | 5.5 mm |
| minimum clearance value - non-homogenous field (III/3) | 5.5 mm |
Technical specifications and performance data
Installation and operation guide