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CCVA 2,5/10-G P20THRR88
CCVA 2,5/10-G P20THRR88 1837336 PHOENIX CONTACT Printed-circuit board connector
$0.00USD
4648 in stock
Key Specifications
Note:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Type:Component suitable for through hole reflow
Pitch:5 mm
Result:Test passed
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Technical Specifications
| Parameter | Value |
|---|---|
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Type | Component suitable for through hole reflow |
| Pitch | 5 mm |
| Result | Test passed |
| Process | Reflow/wave soldering |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| ESD level | (D) electrostatically conductive |
| Frequency | 10 - 150 - 10 Hz |
| Width [w] | 52.8 mm |
| Height [h] | 14 mm |
| Length [l] | 8.6 mm |
| Pin layout | Linear pinning |
| Sweep speed | 1 octave/min |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Product line | COMBICON Connectors M |
| Product type | PCB headers |
| Hole diameter | 1.6 mm |
| Mounting type | THR soldering / wave soldering |
| No. of cycles | 25 |
| Specification | IEC 60512-1-1:2002-02 |
| Number of rows | 1 |
| Pin dimensions | 1 x 1 mm |
| Product family | CCVA 2,5/..-G |
| Thermal stress | 100 °C/168 h |
| [W] tape width | 88 mm |
| Color (Housing) | black (9005) |
| Mounting flange | without |
| Test directions | X-, Y- and Z-axis |
| Article revision | 00 |
| Contact material | Cu alloy |
| Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Installed height | 12 mm |
| Type of packaging | 88 mm wide tape |
| [A] coil diameter | 330 mm |
| Contact resistance | 1.2 mΩ |
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | |
| Insulating material | LCP |
| Number of positions | 10 |
| Number of potentials | 10 |
| Outer packaging type | Transparent-Bag |
| Rated voltage (II/2) | 400 V |
| Contact resistance R1 | 1.2 mΩ |
| Contact resistance R2 | 1.2 mΩ |
| Number of connections | 10 |
| Rated voltage (III/2) | 320 V |
| Rated voltage (III/3) | 250 V |
| Solder pin length [P] | 2 mm |
| Test duration per axis | 2.5 h |
| Surface characteristics | Tin-plated |
| Moisture Sensitive Level | MSL 1 |
| Insulating material group | IIIa |
| Solder pins per potential | 1 |
| CTI according to IEC 60112 | 175 |
| Rated surge voltage (II/2) | 4 kV |
| Tested number of positions | 24 |
| Insertion/withdrawal cycles | 25 |
| Rated surge voltage (III/2) | 4 kV |
| Rated surge voltage (III/3) | 4 kV |
| Solder cycles in the reflow | 3 |
| [W2] coil overall dimension | 94.4 mm |
| Classification temperature Tc | 260 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Rated insulation voltage (II/2) | 400 V |
| Rated insulation voltage (III/2) | 320 V |
| Rated insulation voltage (III/3) | 250 V |
| minimum creepage distance (II/2) | 4 mm |
| Power-frequency withstand voltage | 2.21 kV |
| minimum creepage distance (III/2) | 3.2 mm |
| minimum creepage distance (III/3) | 4 mm |
| Withdraw strength per pos. approx. | 6 N |
| Insertion strength per pos. approx. | 8 N |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Flammability rating according to UL 94 | V0 |
| Impulse withstand voltage at sea level | 4.8 kV |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Contact holder in insertRequirements >20 N | Test passed |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Insulation resistance, neighboring positions | > 5 MΩ |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
Product Description
Printed circuit board base housing, nominal section: 2.5 mm², color: black, nominal current: 12 A, nominal voltage (III/2): 320 V, contact surface: Tin, contact type: Male, number of potentials: 10, n
Key Features
- Industrial grade quality
- RoHS compliant
- CE certified
- 1-year warranty
Product Documents
Datasheet
Technical specifications and performance data
User Manual
Installation and operation guide
